View PC814X_102769.PDF datasheet online --- IC-ON-LINE

Datasheet File OCR Text:

PREPARED BY:
DATE: SW .
SPEC. No.
ED-96 197XB
ISSUE January23, 1998 PAGE 10 Pages
/I: : .q&l,Li APPROVED BY:
g4fi A, iy$? DATE: ELECTRONIC COMPONENTS GROUP SHARP CORPORATION
REPRESENTATIVE DMSION
SPECI: FICATION
DEVICE SPECIFICATION FOR
II
OPTO-ELECTRONIC DEVICES DIV.
PHOTOCOUPLER
MODEL No.
Business dealing name
.
PC814
1. These specification sheets include materials protected under copyright of Sharp Corporation ("Sharp"). Please do not reproduce or cause anyone to reproduce them without Sharp's consent. 2. When using this product, please observe the absolute maximum ratings and the Instructions for use outlined in these specification sheets, as well as the precautions mentioned below. Sharp assumes no responsibility for any damage resulting from use of the product which does not comply with the absolute maximum ratings and the instructions included in these specification sheets, and the precautions mentioned below. (Precautions) (1) This product is designed for use in the following application areas : * OA equipment * Audio visual equipment - Home appliances * Telecommunication equipment (Terminal) * Measuring equipment - Tooling machines * Computers [
If the use of the product in the above application areas is for equipment listed in paragraphs (2) or (3). please be sure to observe the precautions given in those respective paragraphs. (2) Appropriate measures, such as fail-safe design and redundant design considering the safety design of the overall system and equipment, should be taken to ensure reliability and safety when this product is used for equipment which demands high reliability and safety in function and precision, such as ;
1
- Transportation control and safety equipment (aircraft, train, automobile etc.) * Traffic signals * Gas leakage sensor breakers * Rescue and security equipment - Other safety equipment [
(3) Please do not use this product for equipment which require extremely high reliability and safety in function and precision, such as ; - Space equipment - Telecommunication equipment (for trunk lines) - Medical equipment [ * Nuclear power control equipment (4) Please contact and consult with a Sharp sales representative if there are any questions regarding interpretation of the above three paragraphs.
1
1
3. Please contact and consult with a Sharp sales representative for any questions about this product.
CUSTOMER'S APPROVAL
DATE PRESENTED BY
"7 PL u*
DATE BY
T. Matsumura, Department General Manager of ELECOM Group SHARP CORPORATION
Engineering Dept.,11 Opto-Electronic Devices Div.
SHARP CORPORATION
1.Application This spectication applies to the outline and characteristics of photocoupler Model No. PC8 14X. 2. Outline Refer to the attached drawing No. CY8543K02. 3. Ratings and characteristics Refer to the attached sheet, page 4 to 6. 4. Reliability Refer to the attached sheet, page 7. 5. Outgoing inspection Refer to the attached sheet, page 8. 6. Supplement 6.1 Isolation voltage shall be measured in the following method. (1) Short between anode and cathode on the primary side, and between collector and emitter on the secondary side. (21 The dielectric withstand tester with zero-cross circuit shall be used. (31 The wave form of applied voltage shall be a sine wave. (It is recommended that the isolation voltage be measured in insulation oil.1 6.2 Collector current (Ic) Delivery rank table ("0" mark indicates business dealing name of ordered product) Ordered product Business dealing name PC8 14X PC814Xl Rank mark A or no mark A Ic (mA1 0.2 to 3.0 0.5 to 1.5 . Test conditions I,=+ 1mA vc,=5v Ta=25% I
SHRRP CORPORATION
ED-96197XB 1 January 23, 1998
MODEL No.
PC814X
PAGE
Z/8
6.3 This Model is approved by UL. Approved Model No. : PC8 14X UL file No. : E64380
6.4 This photocoupler is designed for AC input.. 6.5 This product is not designed against irradiation. This product is assembled with electrical input and output. This product incorporates non-coherent light emitting diode. 6.6 ODS materials This device - component shaI.I not contain the following materials. Also, the following materials shall not be used in the production process for this device - component. Materials for ODS : CFC,, Halon, Carbon tetracbloride, 1.1.1 -Trichloroethane (Methylchloroforml 6.7 Brominated flame retardants Specific brominated flame retardants such as the in this device at all. PBBO, and PBB, are not used
7. Notes Refer to the attached sheet-l-1.2.
SHARP CORPORATION
Rankmark Primary side mark =I-, 1-k l Z
Pin Nos. and internal connection diagram
Product mass
: Approx.
0.25g
* 1) 2-digit number shall be marked according to DIN standard. *2) Factory identification mark shall be or shall not be marked. Name
UNIT: l/l mm PC814 Outline Dimensions (Business dealing name : PC814X) CY8543K02
Drawing No.
SHARP CORPORRTION
ED-96197XB 1 January23. 1998 MODEL No. t PAGE
PC814X
4/8
3. Ratings and characteristics 3.1 Absolute maximum ratings Ta=25'C Parameter *l Forward current Input *2 Peak forward current *l Power dissipation Collector-emitter voltage Emitter-collector voltage Symbol
IF
Rating +50 +1 70 35 6
unit mA A mW V V
Im P VCEO
vECO
*4 Soldering temperature *1 The derating factors of absolute maximum ratings due to ambient temperature are shown in Fig. 1 to 4. 52 Pulse widths100 ps, Duty ratio : 0.001 (Refer to Fig. 5) *3 AC for 1 mm, 40 to 6O%RH *4 For 10 s
SHARP CORPORATION PC814.x
I
Ta=25C
5/8
3.2 Electra-optical characteristics
output
Collector-emitter breakdown voltage Emitter-collector breakdown voltage Collector current Collector-emitter saturation voltage Isolation resistance
BVECO
IF=0 I,=10 ,uA, I,=0 6 V
Ic V CEbat)
RiSO
IF=+ 1mA vc,=5v IF=+20mA Ic=lmA DC500V 40 to 6O%RH v=o, f=lMHz
0.2
- 3.0 0.2 -
mA v n pF kHz ,KS ps
0.1 5XlO'O 10" 0.6 1.0
Transfer characteristics
r Floating capacitance Cut-off frequency Response time (Rise) Response time (Fall) c-f fc tr If
Vc,=5V, Ic=2mA 15 80 R,=lOO R, -3dB vc,=2v Ic=2mA R,=lOO n 4 3 18 18
SHARP CORPORATION
I
ED-96197XB 1 Januarv23. 1998
MODEL No.
PC814X
PAGE
618
(Fig. 11 Forward current vs. ambient temperature
(Fig. 2) Diode power dissipation vs. ambient temperature
-30
0
25
55 75
100 125
25 Ambient temperature Ta ( % 1 (Fig. 4) Total power dissipation vs. ambient temperature
Ambient temperature Ta ( "C ) (Fig. 3) Collector power dissipation vs. ambient temperature
z
-30
0
25
50
75
100
125
-30
0
25
50
75
100
125
Ambient temperature
Ta ( "C )
Ambient temperature
Ta ( % 1
(Fig. 5) Peak forward current vs. duty ratio Pulse widths 100 pus Ta=25'C
2
Duty ratio
SHARP CORPORRTI ON
ED-96197XB 1 January 23, 1998 MODEL No. PAGE
PC814X
7/8
4. Reliability The reliability of products shall satisfy items listed below. Confidence level : 90% LTPD: 10%/20% Test Items Solderability `2 Soldering heat Terminal strength (Tension1 Terminal strength (Bending) $3 Mechanical shock Test Conditions *1 I 230%, 5s Failure Judgement Criteria Samples (i-i) Defective(C) n=ll, C=O n=ll, C=O n=ll, C=O v,>ux 1.2 I CEO `ux2 I, >' ' ' -2
I 260%, 10 s Weight : 5N 5 s/each terminal Weight : 2.5N 2 times/each terminal 15000m/s2, 0.5ms 3 times/ fX, tY, +Z direction 100 to 2000 to 1ooHz/4min 200m/s2 4 times / X, Y, 2 direction 1 cycle -55 "C to + 125C (30min) (30min) 20 cycles test t6OC, 9O%RH, lOOOh +125%, lOOOh -55-C, lOOOh 1,=+_5OmA, Ptot=200mW Ta=25'C, 1 OOOh U : Upper specification limit L : Lower specitication limit
n=ll, C=O n=ll, C=O
Variable frequency vibration Temperature cycling High temp. and high humidity storage High temp. storage Low temp. storage Operation life I I
n=ll, C=O
n=22,C=O
n=22,C=O n=22 ,C=O n=22,C=O n=22,C=O
I I
*l Test method, conforms to JIS C 702 1. $2 Solder shall adhere at the area of 95% or more of immersed portion of lead, and pin hole or other holes shall not be concentrated on one portion. *3 Terminal bending direction is shown below.
SHRRP CORPORATION
ED-96197XB I January 23, 1998 MODEL No. PAGE
PC814X
B/B
5. Outgoing inspection 5.1 Inspection items (1) Electrical characteristics V,, I,, , v,,,,, I k -0, vi% (21 Appearance
5.2 Sampling method and Inspection level A single sampling plan, normal inspection level II based on IS0 2859 is applied. The AQL according to the inspection items are shown below. Defect Inspection item AQL (%l
I
Major defect
I
Electrical characteris tics Unreadable marking Appearance defect except the above mentioned.
SHARP CORPORATION
MODEL No.
ED-96197XB 1 January23, 1998 1 PAGE
PC814X
Attach sheet- 1- 1
Precautions for Photocouplers
1 For cleaning (1) Solvent cleaning : Solvent temperature 45C or less Immersion for 3 mm or less (2) Ultrasonic cleaning : The effect to device by ultrasonic cleaning differs by cleaning bath size, ultrasonic power output, cleaning time, PWB size or device mounting condition etc. Please test it in actual using condition and confirm that doesn't occur any defect before starting the ultrasonic cleaning. (3) Applicable solvent : Ethyl alcohol, Methyl alcohol, Isopropyl alcohol In case when the other solvent is used, there are cases that the packaging resin is eroded. Please use the other solvent after thorough confirmation is performed in actual using condition. 2. The LED used in the Photocoupler generally decreases the light emission power by operation. In case of long operation time, please design the circuit with considering the degradation of the light emission power of the LED. (50% / 5year.s)
SHARP CORPORATION
ED-96197XB 1 January23, 1998 MODEL No. PAGE
PC814X
Attach sheet- 1
3. Precautions for Soldering Photocouplers
(1) In case of soldering to lead 260 `c 10 s or less
Device ("C)
180 160 -140 120 100 40 20
An example of device temperature vs. soldering time
-
_..- __-- ..-*
_.-- _.--
_..- . . D ..-E
temperature i: --/ -
,.,,I ,. , . `, ; ,I ; Solder edi 12 14 16 18 20
`0 2 4 6 8 10
Soldering time (s)
(2) If solder reflow : It is recommended that only one soldering be done at the temperature and the time within the temperature profile as shown in the figure before.
(3) Other precautions
An infrared lamp used to heat up for soldering may cause a localized temperature rise In the resin. So keep the package temperature within
that specified in Item (2). Also avoid immersing the resin part in the solder.

▲Up To Search▲

Price & Availability of PC814X

	To Download PC814X Datasheet File
If you can't view the Datasheet, Please click here to try to view without PDF Reader .